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For Immediate Release: July 28, 2004
Firan Technology Group Corporation Announces $11,250,000 Credit Facilities
Firan Technology Group Corporation (FTG) announced today that it has entered into a new banking agreement with the Royal Bank of Canada (RBC). The $11,250,000 committed multi-year credit facility is a combination of revolving and fixed term debt.

We are very pleased about our new banking facilities with RBC. Having a strong financial partner will better enable the Company to achieve its long term growth objectives, stated Mr. John Bartkiw, Chief Financial Officer of FTG.

These banking facilities are an important milestone for FTG and will help enable us to move forward with our internal and/or external growth plans, added Mr. Brad Bourne, President and Chief Executive Officer.

RBC offers a full range of financial and investment services to companies such as FTG.

ABOUT FIRAN TECHNOLOGY GROUP CORPORATION

Firan Technology Group Corporation has two operating divisions. FTG Circuits is a leading supplier of high reliability, high technology printed circuit boards. FTG Aerospace manufactures illuminated panels and keyboards for the civil and commercial aviation industries. All manufacturing operations are located in Scarborough, Ontario.

The Company's shares are traded on the Toronto Stock Exchange under the symbol FTG.

This news release contains certain forward-looking statements that reflect the current views and/or expectations of FTG with respect to its performance, business and future events. Such statements are subject to a number of risks, uncertainties and assumptions. Actual results and events may vary significantly.

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For further information please contact:

Bradley C. Bourne
President and CEO
Tel: (416) 299-4000 x314
Firan Technology Group Corporation
bradbourne@firantechnology.com

John Bartkiw
CFO
Tel: (416) 299-4000 x390
Firan Technology Group Corporation
johnbartkiw@firantechnology.com